October 4, 2001 — MUNICH, Germany — Suss MicroTec subsidiary Karl Suss France has completed the expansion of its flip chip bonder manufacturing facility in France that now houses more than 7,500 square feet of cleanroom space.
Officials say the expansion, which doubles the facility’s capacity to nearly 13,000 square feet, will help the company meet the demand for flip chip bonders. The project cost the company $1.86 million.
“Despite the current situation, demand for our high precise flip chip bonders continues to grow,” said Gael Schmidt, president of Karl Suss France. “This expansion was critical to supporting our customer base.”
The new facility will host 130 employees to assemble machinery onsite, which Schmidt said will boost manufacturing speed and output. It was constructed adjacent to Karl Suss’ existing production facilities at Saint-Jeoire in the French Alps.