LSI Logic licenses flip chip packaging technology to Advanced Interconnect Technologies

October 17, 2001 – Milpitas, CA – LSI Logic and Advanced Interconnect Technologies (AIT) announced a licensing agreement in which AIT will license LSI Logic’s organic laminate flip chip FPBGA technology. AIT joins a growing number of companies licensing LSI Logic’s flip chip technology, the companies said.

LSI Logic’s flip chip ball grid array (FPBGA) packaging technology offers a solution for high performance ASIC and system-on-a-chip (SoC) designs, the company claimed.

The licensing agreement provides AIT access to the following LSI Logic packaging technologies: FPBGA-4L (four layer), FPBGA-HP (high performance) and flxI/O flip chip. flxI/O, LSI Logic’s newest packaging family, offers area array I/O placement, enhanced electrical and thermal performance and die size optimization. The agreement also includes assembly processes and materials for the manufacture and qualification of each package type, the use of LSI Logic’s standard package offerings and the characterization data of standard packages.

“With this agreement, AIT now has access to the semiconductor industry’s most advanced flip-chip packaging technology. This is important because we’re seeing increased demand for this technology from our customers in the telecommunications, computing, and storage applications markets,” said Ralph Duceour, president and CEO of AIT. “The agreement extends our technology portfolio to encompass a full-range of offerings from high-volume leaded packages to cutting-edge flip chip solutions.”


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