New Products

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Die-bonding Needle
The Easy Release X Form dispensing tips are designed for conductive epoxy dispensing in die-bonding applications. They are said to be suitable for auger-style pumps with compliant “Z” features. The needles are run in a true-dispense process, not pin transfer. During dispense, the material flows out through an opening in the center of the needle to each of the four channels in the tip, creating the “X” shape.
DL Technology LLC,
Haverhill, Mass.

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Bumped-wafer Inspection System
The SISCAN bumped-wafer inspection system uses patented vision technology and is designed to offer 3-D measurement for bumped wafers used in flip-chip manufacturing. Available as an offline tabletop system, the system's high-speed measurement capabilities make it suitable for integration into high-volume manufacturing processes. The system relies on a laser-based confocal microscope said to be suitable for measuring spherical surfaces, enabling 3-D inspection of bump volumes and surfaces.
Siemens Dematic Electronics Assembly Systems Inc.,
Norcross, Ga.

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X-ray Inspection
The VJ-1000 LP is a high-resolution X-ray inspection system aimed at providing solutions for the surface mount assembly and semiconductor packaging markets. It provides high-resolution images of BGAs, µBGAs and other CSPs with a 4-inch image intensifier, digital X-ray control and 25X to 200X magnification for precise inspection. The system can accommodate PCBs up to 18 x 27 inches for maximum flexibility and comes standard with a 15-inch SVGA monitor and image-analysis software.
V. J. Technologies Inc.,
Bohemia, N.Y.

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No-clean Solder Paste
The Multicore RP15 is a high-speed, no-clean solder paste suitable for fine-pitch stencil printing at rates up to 150 mm/second. Said to perform in air reflow, this solder paste offers printer open time and tack life, extended abandon times and activity for difficult-to-solder parts, including OSP copper. Its operating window and slump resistance are said to reduce solder defects such as bridging and solder balls.
Multicore Solders Inc., a division of Loctite Corp.,
Richardson, Texas.

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Transmissive Optical Sensor
The Telefunken TCST1210 is a high-accuracy transmissive optical sensor that features a 5-mm vertical slot. With a 0.5-mm aperture, the sensor reportedly enables high-accuracy sensing of objects in metering system or DC motor code wheels, VCRs, shaft encoders or mouse and trackball sensors. Suitable for use in compact end products, the unit is said to feature a package height of 10 mm and a 2.54-mm lead pitch. It also provides a 950-nm operating wavelength, 0.4-mm resolution and a typical current-transfer ratio of 10 percent.
Vishay Intertechnology Inc.,
Malvern, Pa.

Polyimides
The HD-8001 is said to be capable of resolving 1-µm features in 3-µm cured films. It was engineered to provide thinner coatings to better accommodate thinner die sizes. The HD-8000 and HD-8001 can be processed in fabs running both I-line and deep UV resists. The products are offered with an NMP-free, edge bead remover to eliminate edge bead and keep the back side of the wafer clean.
HD Microsystems,
Wilmington, Del.

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AOI System
The Vi-1000SP is designed for the solder-paste inspection of PCBs at reported speeds up to 1,000,000 pads per hour. The system is said to verify insufficient or excessive paste deposition on pads, thereby preventing dry joints, bridging and tombstoning during reflow. Using a laser pencil in the axial direction and a camera placed at a 45-degree angle, the system provides data on the height of the solder paste and uses that data to calculate the volume of the solder deposit.
Vision Inspection Technology LLC,
Haverhill, Mass.

Test/Mark/Handling System
The MP630 is an integrated test, mark and handling system capable of providing known good die (KGD) through a single test. It reportedly streamlines the process by combining automated bare-die handling with multiple levels of vision inspection to provide chip producers with KGD packages tested as a die, not as a wafer. The system also houses up to five test stations for sequential, parallel or combined testing.
Ismeca USA Inc.,
Vista, Calif.

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Thickness Measurement/Mapping
EpiScan 1000 is a high-speed film-thickness measurement and mapping tool designed for leading-edge characterization of advanced thin epitaxial films. It reportedly uses a new and improved optical, mechanical, electronics, detector and data-analysis architecture process that measures epitaxial film thickness using IR spectral reflectometry. It reportedly maps 25 points on 200-mm production wafers in less than one minute, thereby reducing wafer-monitoring requirements.
ADE Corp.,
Westwood, Mass.

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Surface Mount Inductors
The SMP 2007 Series of vertical surface mount, toroidal power inductors consists of miniaturized high-current inductors that are said to be suitable for power-supply applications where maximum current-handling capacity and minimum size are equally important. The products offer a housing that allows the inductor to be mounted vertically, which takes up less board space. They are specifically targeted for use in DC/DC converters and power-supply applications where high performance and small size are critical.
Gowanda Electronics,
Gowanda, N.Y.

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Shot Meter
The Kahnetics KDS834A Economy Shot Meter uses an eight-bit microprocessor in its digital- timer control with time duration fully adjustable from 0.01 to 99.99 seconds. The low-voltage unit includes a vacuum feature to prevent dripping, a time-duration indicator light (LED), electrical foot pedal actuation for ergonomics (optional finger switch available), slide switch for change from 110 to 220 V and a 0 to 100 PSI regulator and gage with locking ring. The benchtop unit reportedly offers easy reading of dials and adjustment of air pressure and vacuum.
CooperTools,
Raleigh, N.C.

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Dissolvable Spacers
Wash-Aways spacers are designed to provide consistent spacing between PCBs and components. These organic polymer spacers locate PCB components during soldering operations. After soldering, the spacers dissolve in most water-solvent baths. This reportedly leaves uniform spacing between components and boards, which provides free circulation of air, mechanical protection, filleting and accessibility for inspection, cleaning and conformal coating.
Multi-Seals Inc.,
Manchester, Conn.

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Static Mixers
The Statomix line of static mixers includes a variety of plastic disposable mixers that are used with meter-mix and dispense equipment, providing a solution for two-component mixing. The mixer element is molded from polyacetal to withstand the high pressures generated by meter-mix machines. The line also includes cartridge mixers for use with hand-held dispensing equipment, and in-line steel mixers with elements made from stainless steel or fiberglass-reinforced plastic.
ConProTec Inc.,
Salem, N.H.

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Spring Levelers/Vacuum Cups
This new line of spring levelers and vacuum cups is designed for pick-and-place applications that require the horizontal lifting of uneven-shaped parts and parts from uneven surfaces. Made of nickel-plated steel and brass with stroke lengths from 0.2 to 2.8 inches, the standard spring levelers come in two models and four sizes. Custom-made spring levelers in stainless steel with various stroke lengths are also available.
Vaccon Co. Inc.,
Medfield, Mass.

Automated Desktop Tester
The Automated Personal Kalos is a desktop test system that features an automated device handler. This test solution closes the loop in matrix (strip) test and enables an approach to testing nonvolatile memory devices. It also enables the testing of singulated parts in the matrix-assembly process. This tester extends the capabilities of the company's Personal Kalos tester, a flash memory and flash core microcontroller test system designed to meet the needs of test engineering.
Credence Systems Corp.,
Fremont, Calif.

Laser-scanning Modules
A new line of 3-D laser-scanning modules is designed for integration into OEM or factory-floor equipment has been introduced by Robotic Vision Systems Inc. Based on the company's MicroMap laser technology, the LSM Series of laser-scanning modules provides 3-D inspection performance and reportedly is capable of gathering millions of 3-D data points per second at micron-level accuracies. The inspection modules provide 3-D laser-inspection capabilities for a variety of industries.
Robotic Vision Systems Inc. (RVSI),
Hauppauge, N.Y.

Wire-bonded CSP
Tessera has announced the broad availability of its Wire-Bonded µBGA CSP. This package is a fine-pitch alternative to the lead-bonded µBGA package and offers increased design flexibility. The product uses existing equipment and material infrastructure as well as a simplified substrate and manufacturing process. The package structure supports a range of ball pitches and allows the package to accommodate die shrinks on center-bond configurations.
Tessera,
San Jose, Calif.

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Peel-and-Stick Heat Dissipators
A new line of adhesive-backed peel-and-stick heat sinks is designed for use with BGAs, PBGAs, PLCCs, QFPs, CSPs, µBGAs, and cooling applications with limited clip space. Features of the heat sinks include ease of use, reduced assembly costs, no need for adhesives or greases, good mechanical bond, thermally optimized pin fin, adhesive shear strength at 100°C of 36 psi, and an omnidirectional design.
International Electronic Research Corp. (IERC), a CTS company,
Burbank, Calif.

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Reflow Solder System
The Reflow Solder System RSS-350 was developed for small budget and space purposes. The system has a separate chamber and an external process controller, and is said to be a good tool for various solder processes. Applications include fluxless soldering, solder bump reflowing, encapsulation of housings, soldering of power devices, heat treatment of semiconductor wafers, prototype research, quality control and environmental research. The chamber is hermetically sealed with a viewing window. The heated surface is 110 x 110 mm. Two program-controlled gas lines with flow meters allow the use of either nitrogen or formic gas. With an external pump, the furnace is vacuum capable up to 10-3 mbar.
UniTemp GmbH,
Scheyern, Germany.

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DC to 23 GHz Leaded Packages
The low-cost commercial (LCC) family of DC to 23 GHz amplifier packages for C and Ku band VSAT applications features two or more RF leads and multiple DC leads, providing easy and cost-effective attachment to the next level of the system, while reportedly maintaining the integrity and electrical performance of the IC. The package combines a copper composite base with a patented microstrip-embedded microstrip-microstrip transition design. A plastic cap lid with epoxy perform provides protection for the device.
StratEdge,
San Diego, Calif.

Remote Diagnostic Software
The eTechnician remote diagnostic package enables service personnel to monitor, configure and control fab and test equipment from local and remote locations. eTechnician's real-time data collection may be used to monitor equipment performance and track routine maintenance cycles. With this technology, service personnel can detect potential failures and collaborate with onsite personnel to correct the problem before it affects production.
Excelerate Technologies,
Wellesley Hills, Mass.

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Soldering Tips
The Viper (TATC-608) range of soldering tips has been designed to make the traditionally difficult rework of fine-pitch components faster, easier and safer on Metcal's MX-500TS general purpose rework station. Tips can be changed within seconds via a push-on, quick-release system that does not require special tooling. The tips can accommodate a wide range of components, including 10-pin SOICs and devices up to 15.49 mm in length.
Metcal Inc.,
Menlo Park, Calif.

Modules for Laser Diode Applications
The QubePak module supports the BakPak technology, a temperature-controlling technique for burn-in and test of semiconductor devices. QubePak is said to be ideal for laser diode stabilization, as well as a variety of other tasks in production or test environments. The module can control the temperature of either a single or multiple device under tests (DUT) and applies programmable DC and AC voltage stimulus to each DUT. QubePak also measures DUT voltages, currents and signals, and provides continuous monitoring of DUT power fault detection.
ThetaDelta Technologies Inc.,
Lawrence, Mass.

AP

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