IBM’s New York 300mm Wafer Fab on Target

November 5, 2001 — ARMONK, NY — IBM says its East Fishkill, New York facility is on track to open towards the end of 2003.

So far, the company has completed the modernization of the facility’s cleanrooms and has already added a number of new structures.

The $2.5 billion facility will be used to mass produce semiconductors at line widths below 0.10 microns and use new technologies including copper interconnects, silicon-on-insulator and low-k dielectric insulation on 300mm wafers. The company plans to begin production in late 2002, when some analysts say the semiconductor will begin seeing an upturn.

More than 1,000 workers will be employed at the East Fishkill facility, which IBM officials say represents the largest industrial manufacturing project in New York.

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