November 8, 2001 – Willow Grove, PA & Chandler, AZ – Kulicke & Soffa Industries Inc. and Amkor Technology have expanded the 10-year technology transfer agreement between Amkor and Flip Chip Technologies, L.L.C. (FCT), a wholly-owned subsidiary of Kulicke & Soffa.

The original technology transfer agreement, announced on March 16, 2000, will be expanded to include improvements to the technology covered by the agreement.

Under the original agreement, Amkor gained access to FCT’s proprietary Flex-on-Cap wafer (FOC) bumping and redistribution technologies (RDL) to manufacture advanced flip chip IC packages for both performance and form factor driven applications.

The expanded agreement gives Amkor access to improvements to the FOC and RDL technologies developed during the term of the agreement, including recently developed lead-free, low-alpha and ultra-low-alpha alloys.

According to Richard Groover, Amkor’s VP of flip chip development, the expanded agreement will provide Amkor with the ability to rapidly qualify and bring into production advances in wafer bumping technology at its flip chip assembly and test production facility.

Mr. Groover said, “Lead-free solders, and copper pad compatible bump processes, will be important growth points for our wafer processing portfolio. This enhanced agreement will help ensure our success in these strategic areas.”