Thermal Interface Materials
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Abletherm 3100 is a new family of advanced thermal interface materials for high-performance, flip chip BGA packages. The materials feature good thermal performance, low modulus and high adhesion. This combination provides heat transfer and device reliability reportedly unmatched by thermal greases, gels and phase change materials. These materials have low moisture absorption, and the ultra-low stress bond between the chip and thermal lid survives 1,000 temperature cycles under -75 to 125°C without delaminating. The materials are easily incorporated into standard dispensing processes.
Ablestik,
a National Starch & Chemical Company,
Rancho Dominguez, Calif.
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Photoelectric Sensors
Baumer Electric's line of photoelectric sensors now includes a range of 14-mm diffuse, background suppression, retro-reflective, and through-beam sensors for non-contact detection of a wide array of targets for counting, measuring and positioning. The sensors feature a 14-mm housing, M8 connector and a response time less than one ms; they are ideal for high-speed, space-restricted applica-tions. All Series 14 photoelectric sen-sors feature IP67 sealed, ultrasoni-cally welded, industrial-grade plastic housings for use in a range of industrial environments.
Baumer Electric Ltd.,Southington, Conn.
UV Light Cure Adhesive
Hysol UV 702 is a moisture-resistant ultraviolet light cure adhesive designed for a range of optical pathway bonding applications for photonic devices. The product is a low-viscosity acrylic material that can wick into and fill small gaps of less than 25 microns. It requires no primer and has been modified to provide good adhesion retention after exposure to damp heat. The product is said to be ideal for bonding lenses, prisms and other optical components where index refraction is important.
Dexter Electronic Materials,
a division of Loctite Corp.,
Industry, Calif.
All-optical Switch Module
The OMM32X32 is a compact module, measuring 200 x 280 x 35mm, that operates over the wavelength range of 1,290 nm to 1,610 nm and operates independent of signal transmission data rates or signal protocol. With a simple serial control interface and 5-volt operation, the OMM32X32 can optically switch 32 input ports to 32 output ports. The product is characterized by ultra low power consumption, low insertion loss and milliseconds range switching time.
OMM Inc.,
San Diego, Calif.
Thermal Profiling
The AutoMOLE Xpert System provides a set of software tools to help the design engineer define a robust target thermal profile for each specific combination of solder paste and reflow oven used in the assembly operation. This target profile can then be distributed to other manufac-turing facilities, ensuring exact replication of process parameters. The system allows operators to quickly and automatically set-up reflow ovens to generate a defined target profile for the specific PCB assembly they are processing.
ECD Inc.,
Milwaukie, Ore.
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Fume Purification System
The Purex 8000 series fume extraction systems automatically keep air flow constant and allow accurate temperature profiles to be maintained in reflow ovens and wave soldering machines. The microprocessor-controlled intelligent purification control program monitors the vacuum and varies the pump's motor speed to keep a constant vacuum. Air flow is kept constant to within a variance of less than one percent throughout the filter life. The extraction system is easily linked to the reflow oven control system via an industry-standard RS423 interface.
Hi-Tech UK,
Rotherham, U.K.
eM-Assembly Expert
Tecnomatix Technologies Ltd. has announced the introduction of eM-Assembly Expert, the latest product in its line of electronics MPM solutions, and the first to be built on the com-pany's new technology platform. eM-Assembly Expert is an upgrade to the company's Unicam product. The product will allow electronics printed circuit board manufacturers to shorten product time-to-market and reduce costs and downtime by making it easier for engineers to define designs of factories, assembly lines, pan-els and circuits. Enhancements include com-plete factory definition, panel-centric process design, multiple route selection, improved user interface, and post-load circuit revisions.
Tecnomatix Technologies Ltd.,
Nashua, N.H.
AOI System
GOEPEL Electronic has extended the assortment of its AOI systems with a 3-D inline solder paste inspection system, the “OptiCon Paste Inspector.” The system checks the solder paste print of each single pad for topography, volume and expansion on the board. It is able to define solder paste height in a surface grid up to 10 microns at a definition of 10 microns; the scan speed is 60 mm/s. The system allows an inspection of PCBs up to 400 x 430 mm. The intelligent camera processes the data in real time, which are transmitted to a PC that displays results and parameters.
GOEPEL Electronic,
Jena, Germany.
Inductive Components
The Chip Ferrite Beads product line includes the MH High Current Series, MA Chip Ferrite Bead Arrays, MT Low Current/Impedance Series, and the MG, MU, MZ High Impedance Series. Chip ferrite beads are used for noise suppression in digital equipment, automotive electronic equipment, car stereos, car engine controllers, electronic instruments, and computer and peripheral devices. The products are available in six different sizes, ranging from 1.6 mm to 4.5 mm. They are packaged in tape and reel, 1,000 to 4,000 pieces per reel, and can be picked and placed with all standard equipment. Bourns has expanded its SMD Power Choke line by introducing two non-shielded models, the SDR0403 and SDR1105, and one shielded model, the SRR1305. Three different shapes, including square, round and oval, are offered. Bourns has also introduced the CW16 chip inductor, data line dual chokes, and through-hole power inductors.
Bourns Inc.,
Riverside Calif.
Underfill Encapsulant
Zymet has developed a fast flow underfill encapsulant, designated X6-82-5LV. The encapsulant is capable of flowing across CSPs and large BGAs, and has been optimized for adhesion to commonly used organic surfaces. At 110°C, X6-82-5LV will flow across a 750 mil distance in 25 seconds. The product's maximum particle size is 10 microns and will be compatible with future generations of devices having finer pitch and smaller gap heights. The encapsulant is a fast-curing compound, curing in four minutes at 150°C, suitable for efficient in-line processing. Upon cure, it develops a Tg of about 120°C and a CTE of about 31 ppm/°C.
Zymet,
East Hanover, N.J.
Multichip Die Bonder
Datacon's next-generation multichip die bonder that offers 300-mm wafer handling, the 2200 apm+, is an extension of the modular platform concept for advanced packaging. These die bonders integrate seamlessly into the modular platform concept, ensuring flexibility and reliability. Different modules can be arranged consecutively, so that either the throughput can be multiplied or tasks can be processed in parallel. The system has full MCM capability with automatic wafer changing, automatic tool changing, multichip ejector carrousel system, die attach and flip-chip capabilities. It is compliant with the SEMI SECS standards.
Datacon,
Radfeld, Austria.
