November 27, 2001 — SAN JOSE, CA — Programmable logic solutions provider Xilinx has produced its Virtex-II chips on 300mm wafers made at UMC’s Fab12A in Taiwan.
We have been working closely with Xilinx to aggressively develop our 300mm capabilities,” said Robert Tsao, chairmen of USC. “The impressive efficiency and yields seen at Fab 12A prove that we have mastered the learning curve for this advanced manufacturing.”
UMC’s Fab12A uses 0.15um logic technology. Company officials say the 300mm wafers have better yields than 200mm wafers.
Fab12A is the second UMC 300mm facility to produce chips for Xilinx. Trecenti Technologies in Japan also produced the chips.