ASE introduces multi-package BGA

SANTA CLARA, CALIF. – Advanced Semiconductor Engineering Inc. (ASE) has launched its new multi-package ball grid array technology (MPBGA), a member of the multi-chip module (MCM) package family. MPBGAs differ from traditional MCMs in that with ASE's technology, the chips are first packaged and tested, then stacked or assembled. Traditional MCM packaging does not use known good die – the process includes stacking the chips first, and then testing the finished package.

This difference causes MPBGAs to have a very low rate of package failure. In addition, because MPBGA is a single BGA package consisting of two or more packages, the area of the printed circuit board allotted to the devices can be further reduced. MPBGA is suitable for integrated graphics and memory chips, both of which require high-speed and high-performance capabilities.

Currently, many customers want system-on-a-chip (SoC) solutions, yet these solutions are not commercially viable because of a high technology entry barrier, costly and lengthy development time, and low production yields. Until those barriers can be broken, MPBGA offers a good alternative because it enables more chip functions to be integrated onto a package.

“MPBGA is a stepping stone for the semiconductor industry's transition from a single-function chip to system-on-a-chip,” said J. J. Lee, vice president of R&D at ASE.

MPBGA technology was sampled in the second and third quarters of 2001. Volume production will begin before the end of the year, with a monthly capacity of 100,000 units.


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