Dec. 5, 2001 – San Jose, CA – Electroglas, a supplier of test and inspection equipment, has joined the Semiconductor Equipment Consortium for Advanced Packaging (SECAP).

Electroglas’ inclusion into SECAP brings optical inspection of bumped and redistributed wafers as well as electrical test of these wafers to the consortium’s equipment portfolio.

“Optical inspection is a critical step in wafer bumping technology, especially for analyzing the uniformity of the bump height across a wafer. This uniformity is of critical importance to the reliability of the subsequent assembly process,” explained John Dralla, VP OF marketing and sales for Electroglas. “Together with Electroglas, the SECAP consortium can move forward with the development of 300mm wafer bumping, WL-CSP and lead-free bumping technology.”

In November 2001, SECAP accepted the resignation of Unaxis Semiconductors from the consortium. The resignation was necessary after Unaxis strategically aligned itself with a packaging technology provider. The SECAP charter states that the consortium is neutral regarding any technology provider of advanced packaging technologies. SECAP independently supports all technology providers such as the flip chip division of Kulicke&Soffa, Unitive, Fujitsu, IEP, Shinko, PacTech, ShellCase, or any other company offering technology licenses to the industry.

SECAP was established to support the packaging industry. In the next five years, the number of wafers requiring bumping or redistribution processes is expected to increase by 500%.