Kulicke & Soffa, Amkor Technology complete flip chip technology transfer

Dec. 5, 2001 – Willow Grove, PA & Chandler, AZ – Kulicke & Soffa Industries Inc. and Amkor Technology have successfully transferred K&S Flip Chip Division’s wafer bumping and redistribution technologies to Amkor’s wafer bump fabrication facility in Gwanju, Korea.

The technology license provides for transfer of the Flex-on-Cap and Redistribution (FOC and RDL) wafer bumping technologies employed by the K&S Flip Chip Division in its Phoenix facility, along with all required documentation, training, and engineering support.

To achieve successful transfer, Amkor completed a 35-step certification audit and is now achieving yields equivalent to those at Flip Chip’s Phoenix wafer bumping facility.

“Results with the FOC transfer really speak for themselves,” according to Richard Groover, VP of Flip Chip Development at Amkor. “We transformed an empty space into a customer certified operation in 10 months, and we are moving quickly into production and down a continuous improvement path.”


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