Dec. 20, 2001 – Burnaby, British Columbia – PMC-Sierra, a provider of broadband semiconductors, and Taiwan Semiconductor Manufacturing Company (TSMC) will collaborate on developing SoC products using 0.13-micron technologies.
PMC-Sierra’s SoC devices demonstrate high levels of integration using CMOS technologies, supporting multiple 3.125 Gbit/s Serial Links, SSTL2 interfaces, more than 12 Mbit of embedded SRAM, RISC cores and greater than 4 million logic gates on a single chip.
“To date, we have delivered 33 fully functional 0.13-micron products to our customers and expect to receive over 60 production tapeouts by the end of the year,” said Rick Tsai, TSMC president. “Our process technology roadmap helps companies ramp architectures, such as PMC-Sierra’s MIPS-based processor products, quickly to volume production.”
The 0.13-micron technology platform supports logic, embedded SRAM, embedded flash, and mixed-signal/RF technologies for SoC applications. The process features copper interconnects and Low-k dielectrics from reduced interconnect delay.
“PMC-Sierra and TSMC are responding to our customers’ demands for higher levels of integration without a compromise of high power expenditure and large footprint,” said Greg Aasen, COO at PMC-Sierra.