Sony opens R&D center for chip-mounting technology

Dec. 21, 2001 – Tokyo, Japan – Sony Corp. has opened a semiconductor-mounting technology R&D facility within its semiconductor assembly plant in Oita Prefecture.

The R&D facility, which began operation in early December, will develop mounting technology to reduce the size of chips and lighten them. The new facility is starting out with a staff of 200 people, reported Nihon Keizai Shimbun.

The company has set up a special lab at the facility to develop SIP (system-in-package) technology, which involves placing multiple semiconductors in a single package.

Sony plans to move semiconductor assembly equipment at the Oita plant to a production subsidiary in Thailand by March 2002. As a result, it has decided to expand research facilities at the plant.


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