UTAC, Enhanced Memory Systems develops flip-chip chip-scale package

Dec. 19, 2001 – Colorado Springs, CO – United Test and Assembly Center Limited (UTAC), and Ramtron International Corp. subsidiary Enhanced Memory Systems Inc. have jointly developed a flip-chip chip-scale package (FC CSP).

The package was developed for the 72Mbit double data rate enhanced static random access memory (DDRESRAM) program at Enhanced Memory Systems, targeted for use in workstations, servers, and communication systems. The UTAC FC CSP is capable of providing high pin count density and improved device performance in small form factor, simultaneously serving the industry’s increased demand for higher device speed and miniaturization, the companies said.

The UTAC FC CSP uses established flip-chip packaging methodology. The wafer is bumped to add conductive interconnects on the silicon die pads, eliminating the need for wire bonding. The use of this technology helps to improve package electrical and thermal performance, according to the companies. In addition, the entire IC surface can be used for interconnectivity that allows higher I/O count per unit area.


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