Jan. 4, 2002 – Delft, Netherlands – The Delft Institute of Microelectronics and Submicron technology (DIMES) was chosen by Philips to carry out a major research program in high-frequency silicon technology for communications and connectivity.

Philips identified RF technology as an important long-term research objective with extensive market potential and high-innovation possibilities. Novel materials, innovative device and passive component structures and their integration concepts, as well as basic RF circuits, are the project targets.

DIMES has founded the Philips Associated Center at DIMES to host the research. The cooperation includes an extensive funding of researchers, materials, processing, and support staff, and the contract is the largest externally funded co-operative research program in the 15-year-history of DIMES.

The program aims at the integration of RF systems on a silicon chip. The combination of electronic components on the same silicon substrate has the advantage that hundreds of the components are fabricated in parallel, which drastically reduces the cost of manufacture. Low cost of a RF system is important in mass consumer products, as is low power consumption, if the RF systems are operated from a battery instead of from a power outlet.