IDT to consolidate fab production

Jan. 11, 2002 – Santa Clara, CA – Integrated Device Technology Inc. (IDT) will consolidate its wafer fab operations into the company’s Hillsboro, OR manufacturing facility by 2H02.

IDT’s manufacturing consolidation plans include the closure of its Salinas, CA fab, affecting some 260 manufacturing and related support positions. The SRAM, multi-port and IP co-processor business groups, which occupy office space at the Salinas facility and employ approximately 90 people, will not be impacted by the fab’s closure and are expected to remain located in the Salinas area.

“Because of the current economic downturn, it has become very challenging to cost-effectively load the Salinas facility with the older technologies it supports,” said Jerry Taylor, IDT’s CEO. “While economic conditions have accelerated the need to consolidate production volumes in the Hillsboro facility, we have the manufacturing infrastructure in place to support both our short- and long-term needs.”

“In addition to providing for IDT’s future product-related process technology needs, management believes that consolidation of fab production volumes into one manufacturing facility will improve the financial leverage in IDT’s business in 2002, without impacting revenue generation potential in the company’s focus markets,” said Alan Krock, IDT’s CFO.


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