MEMC moves to full-scale 300mm production

Jan. 10. 2002 – Utsunomiya, Japan – MEMC Electronic Materials Inc. has completed the transition of its center of excellence (COE) from a pilot line to a full-scale 300mm silicon manufacturing site.

MEMC has named Steve Brunkhorst as director of 300mm manufacturing. In this position, Brunkhorst will lead the implementation of MEMC’s processes and systems for 300mm wafer mass production, integrating full-scale 300mm manufacturing into MEMC’s world-class network.

Established in 1997 at Utsunomiya, Japan, the COE initially provided engineering samples to various consortia, equipment companies, and semiconductor pilot lines. During the last 18 months, the COE has shipped 300mm wafers to major 300mm start-up fabs in the US, Europe, and Asia.

“MEMC’s 300mm processes are sufficiently developed and ready to be implemented in a manufacturing environment,” stated Klaus von Horde, president and CEO of MEMC. “High quality and efficient 300mm wafer production is a key focus of our company. MEMC’s improved financial position enables us to increase 300mm spending in 2002, depending on market conditions. ”

Brunkhorst will ensure that the 300mm manufacturing processes are transferable to other MEMC facilities using the copy-exact approach. Additonally, he will ensure that the 300mm site is fully integrated into MEMC’s worldwide silicon wafer network. Brunkhorst has been with MEMC for 28 years and brings over seven years of 300mm experience to this new position. He has represented MEMC on various silicon wafer standards committees.


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