MicroScale begins bumping services in Korea

YULBUK, KOREA – MicroScale Co. Ltd., Korea's largest chip bumping house, has begun to operate a bumping line for semiconductor chips. Fitted with an Au-bumping line for LCD-driving ICs, the company uses the technology on both six- and eight-inch wafers. It also offers wafer-level testing for local customers. Bumping, testing and assembly all take place under one roof.

“The demand is expanding as electronic and information devices require chips with more power and smaller size,” said Kim Byung-su of MicroScale.

The company plans to apply the flip chip solution to a wafer-level memory package in 2003.


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