The MEPTEC and Advanced Packaging Technologists of the Year Award

By Julia Goldstein

The Third Annual Microelectronics Packaging Technologist of the Year Award, sponsored by the Microelectronics Packaging and Test Engineering Council (MEPTEC) and Advanced Packaging magazine, was presented in October during a special MEPTEC luncheon. The award was developed to recognize individuals who have played an integral role in the development of technologies that have impacted the back-end of the semiconductor industry.

This year's recipients were Howard Wilson (ADC Photonics), Paul Lin (Kulicke & Soffa) and Michael McShane (Motorola) for their work at Motorola that began in 1988 and was patented in 1993 (“Semiconductor Device Having a Pad Array Carrier Package”). The work has just reached commercial acceptance in recent years. Motorola's Over Molded Pad Array Carrier (OMPAC), commonly known as the plastic ball grid array (PBGA), was originally developed for an internal Motorola group.

Many took time out of their busy schedules to attend this year's awards luncheon.
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In their acceptance speeches, the award winners mentioned the various forces required to allow their OMPAC package to become viable. Lin stressed that taking a new idea from concept to volume production takes many different people, and that materials, process, assembly and test engineers all play important roles. For example, the machine developed by a Motorola manufacturing group to place solder balls on the packages is still in use today.

McShane and Wilson thanked customers for overcoming their initial objections that they didn't know how to use or inspect a BGA and eventually adopting the package. Wilson mentioned that packaging is often considered as an imposition to IC designers and is incorrectly blamed for reliability problems. He compared development of the PBGA to current growth in telecommunications and fiber optics, emphasizing that packaging needs to be considered as part of the solution rather than part of the problem.

The event, originally scheduled to take place on September 12th, included a Red Cross fundraiser and a technical talk by Tru-Si Technologies.



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Michael McShane discusses some of the obstacles the group encountered in having customers adopt the package. (right)

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Paul Lin accepts his award from Rob Cole. (above)

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The 2001 Technologist of the Year award co-recipients Michael McShane, Paul Lin and Howard Wilson proudly display their crystal awards. (above)

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Adriana Flores, director of community services of the Palo Alto chapter of the American Red Cross, spoke about the days she spent in New York City after September 11th. The luncheon, originally scheduled for September 12th, became a Red Cross fundraiser. (right)

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Rob Cole (Fico America), a member of the MEPTEC advisory board, kicks off the luncheon. (right)

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Howard Wilson receives his award from Rob Cole. (above)


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