Cool Chips 2002 conference lineup

Portland, MAINE – Intertech has set the agenda for its conference, “Cool Chips 2002 – Developing New Market, Material and Design Strategies for Thermal and Power Management,” which will be held April 3-4 in Monterey, California, at the Monterey Marriott Hotel. With packaging being a critical part of thermal management in electronic products, Advanced Packaging magazine is acting as the media partner for the event. The Conference Chair is John Baliga.

The pre-conference seminar, “Future Directions of IC Packaging,” will be held April 3. This seminar will be led by Joseph Fjelstad (Pacific Consultants) and will cover design, construction and key performance features of chip scale packages and their impact on future interconnection structures and design standards now in development, as well as innovative future options in IC package design, such as wafer-level and folded and stacked chip packaging.

Conference speakers will address the industry's “low power road map” and the changes in microarchitecture that need to be addressed to meet burgeoning market demand for computing power with reduced heat build-up and power loss. Presentations, question and answer sessions, and the panel discussion will emphasize IC market trends, as well as the emergence of new semiconductor materials, innovative packaging technologies, system level architecture analysis, and novel thermal management techniques.

Jeffrey Demmin, Advanced Packaging's editor-in-chief, will present a talk entitled “Recent Advances in Thermoelectric Cooling.” He will review principles of thermoelectric cooling, present new molecular scale advances in the field and discuss implications of the breakthroughs.

For more information, contact Susan Brahms, Intertech Conferences: 207-781-9800; Fax: 207-781-2150; E-mail: [email protected].



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