Feb. 4, 2002 – Willow Grove, PA – Kulicke & Soffa Industries Inc. is set to cut 200 jobs, and restructure its organization.
The company has implemented an organizational model under which the marketing, engineering, manufacturing, and customer operations will operate with responsibility for all equipment, packaging materials, and test interconnect products. Excluded from this model are the flip chip and substrate divisions, which will continue to operate as separate business units.
The company has also decided to establish a supply chain in China for the company’s equipment products and to shift a portion of the manufacturing of capillaries, saw blades, and selected test products to a facility outside of Shanghai.
In addition, machine integration for the microelectronics group of products will join ball bonder manufacturing at the K&S Singapore facility. The transfer of microelectronics to Singapore will begin later this year. The China facility is expected to be fully operational by late 2003.