Philips, TriQuint sign compound semi agreement

Feb. 19, 2002 – Hillsboro, OR – Philips Semiconductors, a division of Royal Philips Electronics, and TriQuint Semiconductor Inc. have signed an agreement for a strategic partnership that guarantees Philips Semiconductors controlled access to TriQuint’s InGaP HBT 150mm wafer processing facilities, and provides for joint development of future process technologies.

Both partners will sell their own products in the market. Early collaboration has already resulted in a new W-CDMA PA module and PA/FE modules for GSM phones available from Philips. TriQuint is currently shipping PA products into the CDMA market and offers this InGaP HBT process, as well as other GaAs processes to the market through its open foundry.

Future development of advanced processes will focus on consumer applications for mobile communication markets.

This new agreement cements a long-term relationship between the two companies since 1996, combining TriQuint’s knowledge in advanced semiconductor technology with Philips Semiconductors’ RF design and applications know-how in the production of RF modules.


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