The 2002 Advanced Packaging Awards Entry Form
All entries are due on or before Wednesday, April 17.

CATEGORIES
Please complete the following information and attach to entry materials. (Use one entry form per entry.) Check one entry category:

• Imaging/Inspection Equipment (such as X-ray, material analysis, manual vision, automated optical inspection, laser)
  
• Function Test Equipment (such as sockets, test equipment, probing, electrical, in-circuit)
  
• Die Placement and Attach (such as epoxy and eutectic component assembly)
  
• Encapsulation/Molding
  
• Thermal Management
  
• Handling Equipment and Fixtures (such as process carriers and tooling)
  
• Flip Chip Processes, Materials and Products
  
• Package Design and Analysis
  
• Wafer Dicing/Thinning
  
• Wire Bonding (including wire, ribbon and TAB bonding)
  
• Surface Treatment Equipment
  
• Quality Management Tools (such as CIM and process optimization)
  
• Specialized Advanced Packaging products (such as leadframe tapes)
  
• Substrate and Submount Materials and Technologies

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Contact Name

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Company

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Address

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City, State/Country, Zip Code

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Phone and Fax

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E-mail

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Product Name

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Date Product or Service Was Available for Sale

SUBMISSIONS
Send entries on or before Wednesday, April 17, to:
The 2002 Advanced Packaging Awards
c/o Hunter Marketing
1355 Beckett Lane
Schaumburg, IL 60173
Tel: 847-517-4409

ELIGIBILITY AND REQUIREMENTS
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