March 21, 2002 – Santa Clara, CA – Applied Materials Inc. has unveiled a new Process Module Technology Center, a facility for semiconductor process technology development.
The facility, equipped with a full complement of process, yield enhancement, and automation technologies, can speed customers’ development and introduction of sub-100nm copper-based chips, Applied said.
The new center is Applied Materials’ second dedicated technology development facility in Silicon Valley. Located in Sunnyvale, CA, the new 166,000-square-foot facility features 39,000 square-feet of cleanroom space with ISO Class three air handling and capacity to house over 300 individual pieces of process and support tools.
Applied Materials’ investment in the new facility includes the availability of advanced DUV photolithography support, including both 248 and 193nm wavelength 300mm wafer patterning capability. Complete analytical and testing capability is available for electrical and reliability verification of device performance.