Axcelis partners with Fudan U. for semiconductor R&D

March 25, 2002 – Beverly, MA – Axcelis Technologies Inc. has formed a cooperative R&D partnership with Fudan U. in Shanghai, China.

The partnership brings Axcelis’ expertise in ion implant and rapid thermal processing technologies with China’s academic microelectronics R&D center.

“China is poised to become one of the top regions for semiconductor technology development,” said John Poate, CTO of Axcelis.

“Working alongside Axcelis in Shanghai is a unique opportunity for the students and faculty of Fudan,” said Professor Tang Ting-ao, director of the Institute of Microelectronics, Fudan U. “It is this type of collaboration that will help us build a strong semiconductor industry in China, one capable of developing great people, products, and processes.”

The partnership is focused on advanced process and device development. The R&D program will take place at both Fudan U.’s Microelectronics Center in Shanghai and Axcelis’ Advanced Technology Center in Beverly, MA.

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