CA Micro Devices, ASMC of Shanghai pen agreement

March 8, 2002 – Milpitas, CA – California Micro Devices (CMD) has entered into a wafer supply agreement with Advanced Semiconductor Manufacturing Corporation (ASMC) of Shanghai.

This agreement establishes ASMC as a manufacturing site for CMD’s application specific integrated passive (ASIP) devices and analog semiconductors.

ASMC operates two fab lines: a 5-inch, class 10 bipolar line and a 6-inch, class 1 CMOS line, which combine for a capacity of 480,000 wafers/month. ASMC has earned quality certifications including ISO 9002, QS-9000 and ISO 14001.

The two companies have worked closely in transferring CMD’s thin film processes to ASMC to support production of its ASIP product line. Additionally, CMD will utilize ASMC’s CMOS process to produce its line of analog semiconductors.

CMD has begun transferring manufacturing processes to ASMC and expects the transition to be completed by 3Q02. This allows CMD to restructure its manufacturing facilities and focus product needs between the Tempe, AZ, facility and the ASMC foundry in Shanghai.


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