March 20, 2002 — Hudson, NH — Hodess Building Company (HBC) has just completed a design/build project valued at $5,000,000 for Bandwidth Semiconductor. The facility houses approximately 10,000 square feet of designated ISO Class 5 through Class 7 cleanroom space.

With the expansion completed, Bandwidth hopes to increase their market share of epitaxial wafers, foundry services and advanced OEM devices for data and telecommunications applications.

"Many advancements in MOCVD and fab equipment in our new facility enhance our technical capability. We are already beginning to see more interest in our products since we’ve moved our business to this new state-of-the-art facility," notes Ed Gagnon, General Manager at Bandwidth.

Hodess provided process piping and systems, including clean dry air, process vacuum, deionized water, nitrogen, process cooling water, wastewater treatment, high purity gas distribution, waste piping and scrubbed exhaust. The company also added a new central utility area, which provides chilled water, steam, hot water and new primary power.