IBM, Xilinx sign multimillion-dollar manufacturing deal

March 4, 2002 – East Fishkill, NY, and San Jose, CA – IBM and Xilinx have signed a two-year, multimillion-dollar agreement under which IBM will manufacture Xilinx Virtex-II Pro semiconductor products.

IBM plans to manufacture the parts for Xilinx using IBM’s 0.13- and 0.10-micron copper-based chipmaking technology. This is the first time IBM will manufacture high-volume parts for a foundry customer using its most advanced processes, normally used in microprocessors, custom chips, and memory products.

The Xilinx products will be manufactured at IBM facilities in Burlington, VT, and East Fishkill, NY.

The Virtex-II Pro products are the result of a collaborative design effort between the two companies, integrating IBM’s PowerPC microprocessor with Xilinx field programmable gate array (FPGA) technology to form a new type of hybrid chip for use in communications, storage, and consumer applications.


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