March 4, 2002 – Milpitas, CA, and Fremont, CA – ACM Research Inc., and LSI Logic Corp. have signed a joint development agreement, calling for LSI Logic to be the first semiconductor designer and manufacturer to incorporate ACM’s stress-free polishing tool into its 90nm copper/low-k technology development program.
“Besides supporting LSI Logic with characterization and development of the process, our goal is to prove that SFP is independent of any low-k material,” said David Wang, ACM founder and CEO.
“We will incorporate ACM’s stress free polishing tool into our 90nm copper/low-k technology development program to ensure that we overcome the difficulties associated with dishing and erosion,” said Wilbur Catabay, LSI Logic director of process module development.
ACM will provide two field engineers and process technology support for tool installation, process characterization, and development. Delivery of the Ultra SFP to LSI Logic’s Gresham, OR, campus scheduled for this spring and operation and first process data is expected in the second half of this year.