Veldhoven, Netherlands – ASML has entered the market for atomic layer deposition (ALD) technology through an exclusive technology licensing agreement with Integrated Process Systems (IPS).
The agreement authorizes ASML to offer ALD technologies, as well as associated processes and formulas developed in Korea, to customers around the globe.
ASML will further develop the ALD technology and the platform to deliver cost-effective solutions for depositing thin films, the company said.
According to VLSI Research, the market for ALD is currently worth $80 million annually and expected to be worth more than $1 billion by 2006, reflecting a compound annual growth rate of approximately 109%.
“Atomic layer deposition is an exciting new technology that has shown tremendous potential for applications in high-k dielectric films, barrier materials, and thin film deposition at the 90nm node and below,” said Jeffrey Kowalski, president of ASML Thermal. “ASML is committed to making this technology available to customers through our global infrastructure and manufacturing capability.”
ASML has committed to the investment, support, and development of the ASML ALD product line, including the development of base and future technology, as well as sales and service programs. The licensing agreement also provides for joint manufacturing efforts by ASML and IPS.