ChipMos acquires chip packaging equipment from Walsin Advanced

April 22, 2002 – Taipei, Taiwan – Chip assembler ChipMos Technologies Ltd. recently acquired the tape carrier packaging (TCP) production lines from Walsin Advanced Electronics Ltd. to boost output capacity to 14 million flat-panel chips/month.

ChipMos is an affiliate of DRAM maker Mosel-Vitelic Inc., of Taiwan, while Walsin Advanced is a chip-assembly affiliate of Winbond Electronics Corp.

After selling the equipment to ChipMos, Walsin Advanced will focus on DRAM chip packaging. The company previously planned to expand specialization into non-DRAM packaging service in cooperation with chip assemblers Walton Advanced Electronics Ltd. and Powertech Technology Inc. The plan failed as a result of disagreements among the three parties, reported the Financial Times.

ChipMos said that it will install the production lines at a factory in the Tainan Science-based Industrial Park and expects it to come online in 3Q.


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