April 18, 2002 – Seoul, Korea – Hynix Semiconductor Inc. has embarked on what it calls the “Prime Chip Project” to apply 0.13-micron process technology to its DRAM production.
Hynix set up a production line with prime chip technology and mass production is scheduled to begin in July, reported the Financial Times.
Hynix said the prime chip project would help expand output per wafer by about 50% and boost cost competitiveness by more than 50%.
After completing the prime chip project, Hynix plans to follow up with the “Golden Chip” project, further narrowing the width of circuit to 0.11-micron.
Meanwhile, Hynix organized a 300mm wafer technology development team at its Icheon memory research center in Gyeonggi Province as part of its R&D project for the mass production of 300mm wafers.