New system automates thermal measurements

BEDFORD, MASS. – Netzsch Instruments introduced a new line of flash diffusivity instruments for measurement of thermal properties, such as specific heat and thermal conductivity. The new system can automatically test multiple samples from room temperature to 200°C. The automated system also uses a new xenon flash and can measure thermal conductivities from 0.1 W/mK to more than 2,000 W/mK, covering a full range of packaging materials.

Flash diffusivity measurements are performed by quickly heating a sample with a flash of light and then measuring its temperature rise using infrared emissions. This can be done with thin films or thin adhesive bondlines, for example. Because this is a non-contact technique, there is no extraneous thermal resistance added to the measurement process by an interface. The measurements can also be done on samples that reflect the geometry of the real application, rather than bulk samples that are not representative of the actual usage.

The capability of this kind of equipment is important as thermal management materials are used in smaller geometries.

References for “Die Attach Solder Design” published in the February 2002 issue are available online at


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