ESI forms partnership with OptiViz Technology

May 1, 2002 – Portland, OR – Electro Scientific Industries Inc. (ESI) has developed a new IC package inspection system in a strategic partnership with OptiViz Technology Inc. The system will perform high-speed, 3D inspection of ball grid arrays (BGAs), chip scale packages (CSPs), and other bumped ICs handled in trays, the companies said.

The partnership allows ESI to add to its current product portfolio of inspection systems for the backend semiconductor market. ESI will add its proprietary vision system to the product and has an option to acquire full rights to the product.


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