Jazz Semi partners with MEMSCAP for MEMS-based wireless ICs

May 29, 2002 – Newport Beach, CA and San Jose, CA – Jazz Semiconductor, an independent mixed-signal and RF silicon wafer foundry, has entered into a joint manufacturing and marketing agreement with MEMSCAP, a provider of MEMS solutions.

The agreement will enable Jazz to provide its customers with a single source for wireless semiconductor ICs incorporating MEMS-based components. This new RF IC foundry offering will provide lower cost per component, higher performance, and reduced circuit size through tighter integration, Jazz said.

Under the terms of the agreement, Jazz will manufacture SiGe wafers and MEMSCAP will add on-chip passive components such as high-Q inductors, high-value capacitors, and other high-performance passive components using its Above-IC post-processing technology.

Jazz will market the single-source solution to its customers, while MEMSCAP will focus on design and production support.


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