For more information, circle the corresponding numbers on the reader service card and mail back. For faster results, fax the card to 413-637-4343, or visit www.onlinecenter.to/ap.
X-ray Inspection System
The FXS-160.40 inspection system is designed for off-axis inspection of planar devices. The system is assembled for modular manufacturing with X-, Y-, Z-axis manipulation, tilt and rotate features, and the company's X-ray tube. The detector can be rotated 360° and angled up to 50° for complete oblique angle viewing without sample repositioning.
For free data, circle 203 or visit www.onlinecenter.to/ap.
The FC250 device bonder optimizes cost-effective volume production of optoelectronic modules. Its ability to perform standard component attachment and flip chip with an accurate and gentle material handling makes this bonder ideal for handling brittle substrates. The system features an advanced imaging system offering sub-micron alignment and a specially designed bonding arm that results in a post- bonding accuracy better than 1 micron, while maintaining a high throughput of up to 250 bonds per hour.
For free data, circle 204 or visit www.onlinecenter.to/ap.
Thermal Analysis Software
TAS V6.1 is thermal analysis software that includes an integrated thermoelectric cooler element, which accurately predicts TEC performance at the system level. This software is said to significantly reduce the design process. By automatically creating a 3-D representation of a Melcor thermoelectric cooler, the software will accurately simulate the TEC's behavior over its entire operating range in both heating and cooling modes.
Harvard Thermal Inc.,
For free data, circle 213 or visit www.onlinecenter.to/ap.
Aqueous Cleaning System
The Stoelting OmniJet Advanced Packaging In-line Aqueous Cleaning System (APILACS) cleans and dries flip chips and BGAs. A proprietary spray and airflow system ensures clean and dry products even in high-production, in-line environments.
For free data, circle 215 or visit www.onlinecenter.to/ap.
Image Sensor Sockets
A new line of image sensor sockets have been designed for Amkor Technology's VisionPak ceramic leadless chip carrier (LCC) package. The sockets are for packages to be inserted “live-bug” with the glass top up to access during test. The sockets are available for 28-, 32- and 48-pin VisionPak LCCs.
Plastronics Socket Co.,
For free data, circle 217 or visit www.onlinecenter.to/ap.
Memory Test System
The AL6050 is a memory test system used for 300-mm wafer testing. This memory device test system reduces test time and cost by doubling parallel measurement capabilities for 300-mm wafers. Features include two test stations for cost-effective parallel measurement of 128 or 256 devices, a mounted high-speed redundancy analysis unit, a graphic user interface, and a program development system.
Ando Electric Co. Ltd.,
For free data, circle 211 or visit www.onlinecenter.to/ap.
Chemical Monitoring System
The Quali-line QLC-6000 is an automatic on-line system for measuring organic additives and inorganic components. The system offers a Windows-based platform, a touch-screen monitor and improved handling of data. The new features increase analysis speed and provide a simplified system operation, as well as enhanced data access and storage capacity.
East Rutherford, N.J.
For free data, circle 210 or visit www.onlinecenter. to/ap.
NEC's 10 Gbps receiver modules are used in optical networking, work within the 1.3 to 1.5-wavelength range, and are mounted with an amplifier on a small class of metal ceramic packages. The receiver module facilitates conversion of optical to electric signals, and is said to be an essential device for 10 Gbps digital transmissions over optical fiber networks.
NEC Compound Semiconductor Devices Ltd.,
Kanagawa, Japan, and
Sumitomo Electric Industries Ltd., Osaka, Japan.
For free data, circle 216 or visit www.onlinecenter.to/ap.