UMC and Ricoh broaden manufacturing partnership

May 13, 2002 – Taipei, Taiwan, and Sunnyvale, CA – UMC has developed a specialized ASIC for Ricoh Company Ltd. The IC, built for imaging processing equipment, is based on UMC’s 130nm copper/low-k technology with mass production for the chip expected in August.

UMC provided supporting design services including 130nm libraries, IP resources, and integrated design rules to facilitate smoother design-in, while Ricoh shared its product data and worked together with UMC engineers to achieve first silicon success.

Fu Tai Liou, chief officer of worldwide sales and marketing from UMC, said, “We are committed to providing our foundry services, as well as our 130nm process, to help Ricoh, a provider of office equipment, achieve its market goals. We have also agreed to expand our manufacturing partnership to assure Ricoh ongoing access to UMC’s capacity in order to meet the growing demand for its products.”


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