Updates on folded flex and thin packaging at ICAPS

Web Exclusive: Meeting Report

RENO, NEV. – IMAPS held its first International Conference on Advanced Packaging and Systems (ICAPS) in March in Reno. The event featured sessions on most critical areas of advanced packaging technology, including design and test, 3-D packaging, MEMS packaging, and thermal management. Tabletop exhibits accompanied the two parallel technical sessions.

For in-depth coverage of this story and more daily industry news updates, visit www.apmag.com.

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