For more information, circle the corresponding numbers on the reader service card and mail back. For faster results, fax the card to 413-637-4343, or visit www.onlinecenter.to/ap.
The DS-107 aligner bonder is an ultra-high precision assembly platform designed to align, place, and attach bare die, components and packages. The system is ideal for alignment accuracy of 1 to 2 microns and bond forces from 5 g to 100 kg. It also can handle die up to 50 x 50 mm and substrates up to 33 x 33 mm. Applications include optoelectronics, die bonding, flip chip and MEMs attach, and CSP assembly.
Eclipse Industries LLC,
For free data, circle 203 or visit www.onlinecenter.to/ap.
Signal Integrity Software
SIwave software is designed to meet the growing demand for quick and accurate signal and power-integrity analysis of IC packages and PCBs. The software enables engineers to model PCB and package structures by using a full-wave analysis engine to generate both frequency- and time-domain results. Its hybrid, finite-element techniques allow designers to characterize simultaneous switching noise, power and ground bounce, resonance, reflection and coupling between traces and power/ground planes.
For free data, circle 200 or visit www.onlinecenter.to/ap.
Adhesive Films and Preforms
A new line of 100-percent solid adhesive films and die-cut preforms eliminate problems associated with solvent-borne adhesives, such as residual solvent outgassing that can affect bond line integrity because of voiding. The increased thickness of 75 mils allows the materials to be used as underfills, encapsulants and in gasketing applications.
For free data, circle 202 or visit www.onlinecenter.to/ap.
Probe Card Analyzer
The PrecisionPoint VX3 Probe Card Analyzer can reduce probe card test times up to 200 percent. The analyzer has a 375 to 4500 test channel capability and up to 375 relay channels. The system is available with many checkplate options to suit different processes and technologies. The analyzer's software-controlled counterweight allows for fast and efficient rework.
For free data, circle 206 or visit www.onlinecenter.to/ap.
Therma-Vent heat sinks use enhanced fin technology to increase the heat sink surface area and create turbulent airflow to disperse heat efficiently. The heat sinks offer reduced mass, less system volume, and lower costs over traditional extrusions and folded fin products.
Thermacore International Inc.,
For free data, circle 207 or visit www.onlinecenter.to/ap.
Fusion Bond Cluster
The CL200 Fusion Bond Cluster is a fully automatic product tool with process control to clean, dry, align and bond in one closed chamber. The fusion bonder processes two substrates simultaneously while producing high yield and high throughput without post-clean contamination. The cluster enables high-yield fabrication of micromechanical devices, such as acceleration, pressure and temperature sensors, optical data processing devices, and microelectronic circuits.
For free data, circle 208 or visit www.onlinecenter.to/ap.
The PVA550 benchtop motion platform is designed for automated adhesive and coating applications. The three-axis platform features a large 400-mm square work area with a programmable 100-mm Z-axis. The motion platform provides a repeatability of ±0.001 inches and comes standard with an LCD screen with function keys and Windows-based programming software.
For free data, circle 205 or visit www.onlinecenter.to/ap.
Substrate Bonding Machine
The ASIGS 200 is a semi-automatic substrate-bonding machine designed for SOA process development, while also enabling small-scale fabrication to provide a bridge from research to volume manufacturing. Developed for substrate transfer of 8- and 6-inch wafers, the machine is capable of producing 25 fully bonded wafer units per hour.
Veldhoven, The Netherlands.
For free data, circle 210 or visit www.onlinecenter.to/ap.