Tundra teams up with Intel to develop chip

June 11, 2002 – Ottawa, Canada – Tundra Semiconductor Corp., a provider of communication chips, has teamed up with Intel Corp. in a multimillion-dollar deal to jointly develop a system interconnect chip.

Terms of the arrangement were not disclosed. The companies are set to develop a chip tailored to Intel’s XScale microarchitecture.

“This collaboration is a win-win situation for storage customers allowing them to benefit from the synergy of pairing the Intel XScale microarchitecture with Tundra System Interconnect,” said Tundra CTO Richard O’Connor.


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