Hsinchu, Taiwan and Munich, Germany – AMD, Infineon Technologies, and UMC plan to collaborate on the development of common 65/45nm manufacturing platform technologies for the high-volume production of semiconductor logic products on 300mm wafers.
Each of the three companies will supply engineering resources and expertise to jointly develop common platform technologies, which will then be tailored by each company to meet specific manufacturing and product requirements.
Initial work for the joint development program will take place at a UMC facility in Hsinchu. With this initiative, Infineon expands upon an existing agreement it has with UMC to develop 130/90nm process technology
and will join the process development program AMD and UMC announced earlier this year targeted for the 65- and 45nm nodes.
With this latest development, Infineon and UMC add R&D activity to their cooperation portfolio, which already
includes a manufacturing joint venture known as UMCi. This 300mm manufacturing joint venture located in
Sngapore is expected to be ready for equipment move-in in January 2003, with volume ramp up in 4Q03.