July 25, 2002 – Tokyo, Japan – Hitachi Ltd. plans to consolidate its four domestic semiconductor-manufacturing subsidiaries into two units, effective October 1, the company said.
The subsidiaries will be reorganized by product and plant location, reported the Nihon Keizai Shimbun.
The move is a preparatory step for Hitachi’s planned integration of its system chip business with Mitsubishi Electric Corp., scheduled for April 2003.
Hitachi Tohbu Semiconductor Ltd. and Hitachi Tokyo Electronics Co. will be merged into a single new entity. Likewise, Hitachi Yonezawa Electronics Co. will be merged with Hitachi Hokkai Semiconductor Ltd.
Hitachi’s semiconductor division has been trimming personnel since a previous restructuring plan announced last October. No additional personnel cuts are planned.