July 2, 2002 – Munich, Germany – NEXX Systems, a spin-off of ASTeX established in August 2001, and a supplier of PVD systems, has joined the Semiconductor Equipment Consortium for Advanced Packaging (SECAP).
With the addition of NEXX Systems, under bump metallurgy (UBM) and backside metallization are added to the consortium’s equipment portfolio.
With NEXX Systems, SECAP closes a technology gap that was opened in November 2001 when the consortium accepted the resignation of Unaxis Semiconductors from SECAP.
The SECAP charter states that the consortium will remain neutral to all providers of advanced packaging technologies. The under bump metallization process is necessary in solder bumping, as well as in gold bumping, and provides typically a stack of thin metal films between the bump and the pad that serves as diffusion barrier, wetting layer and seed layer for electroplating.
SECAP considers NEXX Systems to be the ideal partner to pursue the consortium’s goal of supporting the advanced packaging industry with dedicated process equipment. The SECAP process equipment portfolio now includes wafer plasma cleaning, UBM deposition, resist coating, precision photomasks, exposure and development, UBM spray etching, electroplating, resist stripping and bump inspection.
SECAP is the first consortium of this kind established to support the packaging industry.