July 29–San Jose, CA–The latest development in semiconductors materials and the outlook for the materials market will be the focus of the third annual SEMI Microelectronic Materials Strategy Symposium in September.

The event, which runs from Monday, September 23, through Wednesday, September 25, will be held at The Fairmont, and presented by SEMI–Semiconductor Equipment and Materials International.

The conference, which will cost an attendee $850, will include business and technical sessions, covering topics such as opportunities in the emerging China market; the semiconductor materials market outlook; advanced polymers for SOP packaging; and development cycles for materials integration.

The technical program on wafer processing will address issues in lithography and resist; gas and chemicals; and CMP and metalization. For IC packaging, sessions will cover numerous topics, including compound semiconductors and 3d wafer scale integration.

As materials become an increasingly critical factor in semiconductor manufacturing, staying competitive requires access to the latest technology and business intelligence,” says Elizabeth Schumann, senior director of marketing and research. “Based on feedback from the first two conferences, we have further refined the program to address the key areas of interest to those in the materials industry.”

For more information, log on to www.semi.org or call (408) 943-6981.