SINGAPORE – ST Assembly and Test Services (STATS) has licensed a heat dissipation technology developed and patented by the Industrial Technology Research Institute (ITRI). ITRI, located in Hsinchu Valley, was founded by the Republic of China's Ministry of Economic Affairs to perform applied research in several fields.
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STATS is implementing the thermal management technology is a new version of its Plastic Ball Grid Array (PBGA) package, called the “Exposed Drop In Heat Spreader PBGA” or XDPBGA. The package offers a 20 percent improvement in thermal performance compared to a standard PBGA, according to STATS.
Dr. B.J. Han, the CTO at STATS, said “XDPBGA offers an attractive alternative for devices that require intermediate heat dissipation without the expense of traditional die-down packages.”