UTAC establishes US design center

SINGAPORE – United Test and Assembly Center (UTAC) is setting up a package design center in Pleasanton, Calif., to support the design needs of customers in North America. The service will complement the existing package development center located at UTAC's Singapore headquarters.

Dr. Anthony Sun, UTAC's VP of advanced packaging development, said that the design center will include “core capabilities, such as thermal, mechanical, and electrical package analysis and package layout design, for both leaded and laminate-based packages.” Sun also said that UTAC will also be working on joint development projects on flip chip, CSP and stacked die technologies.


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