Under the agreement, Unitive will become Amkor’s primary source of wafer level packaging solutions in Taiwan, providing wafer level design, repassivation, redistribution, and bumping services. Amkor will provide a broad range of packaging and test services including probe, wafer thinning, substrate design & procurement, assembly, and final test. Together, Amkor and Unitive will provide their joint customers with coordinated project management, seamless logistics tracking, and technical support.

San Jose, California, July 22, 2002 — Universal Instruments is launching its newest flip chip capabilities at SEMICON West 2002 in San Jose at booth 11627. These new offerings include the ability to process bumped devices directly from wafers using either ink dot recognition or wafer map input.