Aug. 27, 2002 – Chandler, AZ, and Santa Clara, CA – Amkor Technology Inc., a provider of outsourced semiconductor assembly and test services, and PMC-Sierra, a provider of broadband semiconductors, have announced the release to production of second-generation flip-chip packaging solutions.

PMC-Sierra worked with Amkor engineers to define the packaging architectures that achieve lower power and smaller die size required for networking equipment, the company said. The new flip-chip packaging solutions are used in PMC-Sierra’s 10 Gigabit Ethernet XENON family of devices and PMC-Sierra’s OC-48 and OC-192 transport optimized CHESS-III chip set.

“Amkor is working closely with PMC-Sierra to develop flip-chip packaging solutions that support high performance applications, ranging from wireless base station equipment to large-scale networking systems,” said Richard Groover, Amkor’s VP for flip-chip technology. “We are also working together on a product roadmap that employs more advanced substrate technologies to further enhance the price/performance of flip-chip solutions.”

“PMC-Sierra is also collaborating with Amkor on third generation flip-chip solutions to create higher performance IC architectures,” said Greg Aasen, COO at PMC-Sierra.