Analysis Tools from Zuken Include Package Re-use

WESTFORD, MASS. – Zuken USA added a “packaging re-use” capability to its Packaging Predictor set of analysis tools. This function lets engineers evaluate whether using an existing package is feasible for a new IC design.

The software will suggest I/O placement on the chip, ensuring that the IC will work in an existing package. This can eliminate the need for creating a custom package, which adds expense and leadtime to the packaging portion of the product development cycle.

This represents another step towards chip/packaged co-design, where some features of the chip design are affected by the package design to optimize the overall system cost and performance.


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