ChipPAC Engineers System Package for High-Performance Applications

Fremont, CA, July 17, 2002 – ChipPAC, Inc. (Nasdaq: CHPC), one of the world’s largest and most diversified providers of semiconductor assembly and test services, today announced that it has successfully engineered a high performance embedded processor module, named the i-Module, with 5 chips in the footprint of a standard Ball Grid Array (BGA) package. The module combines an embedded processor assembled on the bottom side of the package using advanced flip chip technology, with high speed memory chips, multiple passives and a heat spreader assembled on the top side. ChipPAC designed and simulated the total package electrical, thermal and mechanical reliability using its proprietary SmartDESIGNTM process to ensure first time success with predictable performance.

Manufacturing Execution Systems (MES) Interface and Implemented “Embedded” Capability Enables New Level of Equipment Control

SEMICON West, San Jose, Calif., July 17, 2002 – KINESYS Software, Inc., a leading provider of software for the automation of semiconductor manufacturing processes, today announced that ALPS (Assembly Line Production Supervisor) 2.6 is available for immediate shipment.

First introduced in 1995, ALPS is the industry’s leading software for wafer map data management and equipment integration in the inkless assembly of semiconductors. ALPS 2.6 is being displayed at the opening portion of SEMICON West devoted to the “back end” of the semiconductor manufacturing process by a KINESYS partner — Universal Instruments Corporation. It can be seen at the Universal booth (#11627) in McEnery Hall at the San Jose Convention Center July 17-19.


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