Fremont, CA – ChipPAC Inc., a provider of semiconductor assembly and test services, plans to more than double its manufacturing capacity in China.
The move will increase local product development, expanded design, test, and advanced packaging services, as well as enhance support for the company’s existing base of customers in the region.
The new facility will be in excess of 300,000 ft.2 and will more than double ChipPAC’s current capacity at its site in the Qingpu District of Shanghai. Construction will begin in 4Q02 on the campus of its existing manufacturing site. The Company will begin to bring on capacity for customer programs starting 3Q03 in the new facility.